Available in 6 inch (154 mm) and 8 inch (203 mm) diameters to accommodate
wafers up to 200mm in diameter.
Chuck Surfaces:
Choice of gold-plated or nickel-plated surface is standard. (Other optional surface
treatments are available by contacting Temptronic.)
Outstanding Features:
Wide temperature range: -65°C to +200°C in a self-contained system.
No Liquid Nitrogen or CO2 required for cooling
DC Control System minimizes electrical noise
Temperature Accuracy: ±0.5°C (calibrated against transfer standard)
Temperature Stability :±0.1°C
Advanced ThermoChuck Design:
Low stray capacitance and high electrical resistance to ground: Surface Electrical
Isolation: >109 ohms at 500 VDC between
surface and ground at +25°C ; higher isolation configurations are available
Superior chuck temperature uniformity: ±0.5°C or ±0.5% of set temperature
Guarded ( low leakage) chuck configurations are optional
Standard Features:
IEEE-488 and RS232 remote interfaces
Proven high reliability
TP03000 Series Systems interface to most major manual or automatic wafer probing
stations, laser trimmers and inspection stations.
HCFC-free and CFC-free
Certified
Compliant
Applications:
Thermal cycling and steady- state thermal testing of wafers, hybrids and other flat
devices
Low noise test applications
High isolation and guarded (low leakage) applications
Thermal characterization of standard and high power devices at high and low
temperatures.
